Green Manufacturing of Nanoscale Devices

SEM and TEM images are published in https://doi.org/10.1038/s41528-018-0031-3

Fabrication of nanogap electrodes, namely coplanar metal structures separated by a nanogap of around 10-20nm, is traditionally challenging. It requires costly and time- and energy-consuming techniques, such as electron-beam lithography. On the other hand, these nanostructures are offering many advantages to the realisation of devices and circuit elements with lower power consumption, faster operating speed, and higher-level integration.

In the Flexible Nanoelectronics Lab we use these structures as our testbed to investigate the fundamental properties of materials at the nano- or even molecular level. We employ adhesion lithography (a-lith), a facile, inexpensive, high-throughput patterning technology to create our nanogap electrodes. We employ different metal combinations (M1 and M2 in scheme below), different shapes and aspect ratios (square, circular, interdigitated, spiral…) and rigid (Si/SiO2, glass) or flexible substrates (PET, PI) depending on the application.

We combine these coplanar nanogap electrodes with advanced functional materials (metal oxides, polyoxometalates, perovskites, 2D transition metal dichalcogenides, organic semicondunctors, ferroelectric polymers, quantum dots, etc.) to demonstrate high performance in devices, such as radiofrequency diodes, photodetectors, memristive devices, molecular memories and sensors. See below for some relevant articles published using a-lith fabricated nanogap electrodes.

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